Teknek's new SMT-II has set a new benchmark for SMT board cleaning. With low static cleaning and low applied pressure cleaning, SMT-II becomes the perfect cleaning device for removing contaminants from circuit boards before solder paste printing. The industry urgently needs to improve traceability, and the integration of SMT-II with IPC Hermes as standard solves the industry's needs.


configuration

Cleaning width: 40-400mm/40-600mm

Operation mode: single-sided cleaning or straight through mode

Double sided cleaning or straight through mode

Optional cleaning roller: NT ™ - UTF - NANOCLEEN ™

Available dust paper options: AREP or AREF

Processing speed: 1-40 meters per minute

Through height: 900 ± 50min

Main power supply: 85-265Vac

Air source requirement: 5-7 bar "oil-free air"

Product Compliance

Machine: ANSI/ESD s6.1-2014&IEC 61340-5-1 2016

All elastic cleaning rollers: ISO 6123 Class A

NT ™ / NANOCLEEN ™： ANSI/ESD s20.20 – 2014

All sticky paper: FINAT

SMT data

advantage

Low static cleaning

The design of SMT-II focuses on low static cleaning boards in every aspect.

This is achieved through precise design and patented technology of elastic rubber rollers and adhesive paper.

Network System

The communication between devices in the SMT process has never been so important.

SMT-II can not only be fully integrated into the process,

IPC-Hermes 9852 or SMEMA is also used as standard configuration.

interface

The brand new and easy-to-use graphical interface makes the installation and use of SMT-II extremely convenient.

Low applied pressure

Corresponding to thinner and more complex circuit boards, circuit boards become more fragile, and cleaning requires technological advancements.

The pressure at a certain point during cleaning may damage the circuit board.

SMT-II applies minimal pressure to the surface of the circuit board while achieving efficient cleaning and no damage to the board.

Low static cleaning

The all-new SMT-II has a "Follow Me" option. If your SMT process is not controlled by Hermes, this independent automatic width change system will continuously synchronize and monitor the condition of the moving tracks on the equipment before or after SMT-II.

When replacing the circuit board, this function reduces the operator's workload and increases running time.

Equipment size