SMT vacuum reflow soldering is a reflow soldering process performed in a vacuum environment, and its working principle is as follows:German SMT vacuum reflow soldering

Vacuuming: Extract the air from the welding area to create a vacuum environment, reduce oxygen content, and minimize oxidation reactions.

Heating: By using a heating element to raise the temperature of the welding area above the melting point of the solder, the solder is melted.

Welding: In a vacuum environment, the surface tension of the solder will decrease, allowing the solder to better wet the welding surface and improve the welding quality.

Cooling: After welding is completed, lower the temperature of the welding area to room temperature to solidify the solder and complete the welding process.

The working principle of SMT vacuum reflow soldering is to perform reflow soldering in a vacuum environment to reduce oxidation reactions and improve soldering quality.