Technical characteristics

ZEUS is based on PEMTRON's innovative 3D vision technology, developed with over 15 years of 3D experience, which enables us to lead the semiconductor industry.

Our experience and knowledge, as well as our understanding and application of these technologies, enable us to focus on semiconductor product testing. In this industry, we can better demonstrate the quality, performance, and technology of our equipment.

Detection capability

Missing gold wire

Damaged gold wire

Broken or collapsed lines

Gold thread floating up

Gold wire damage

Gold wire short circuit

Not bonded

Arc height defect

Cutting line, gold wire disconnected

Bond point offset

ZEUS combines Moire stripe technology with PEMTRON's independently developed advanced optical detection technology, making it the best optimized detection system.

High precision wafer chip detection without reflection interference

main features

-Reflective wafer chip surface inspection

-Review and analysis of comprehensive testing results

3D detection capability

-Clear resolution

-Optimal Image Processing and Algorithms

Applicable scenarios

SIP/FCBGA/FOWLP/FOPLP/WLCSP

Small device (smaller than 008004) detection

Complete detection, re evaluation, and analysis

True 3D detection function

Optimal Image Processing and Algorithms

High speed GPU and Image Processing

Small component detection capability
Solve your testing challenges through outstanding innovation