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  • JET 9000V Vacuum Circuit Board Testing Machine
JET 9000V Vacuum Circuit Board Testing Machine
  • JET 9000V Vacuum Circuit Board Testing Machine
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  • FAQ
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Vacuum platform massive detection

The vacuum platform has a maximum detection capacity of 8448 points with complete coverage
The whole machine has no flat cables to maintain signal integrity
Complete testing process, modular functional testing supports boundary scan
Exclusive Connection Scan increases coverage

01 Application Range

◆ JET 9000V is a testing platform designed for complex and large circuit boards

◆ The system provides complete analog measurement technology and digital signal measurement

◆ Frequency signal measurement, etc., and flexible integration of external systems to improve product testing projects

◆ Top of the line vacuum testing platform, smoothly contacting each testing point, can fully cover up to 8448 points

◆ It is the best choice for products such as large servers, laptops, etc

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02 System Performance

◆ All signals are affected by noise, distortion, and loss

◆ If a long-distance, high bit rate signal passes through several different conductors

◆ Multiple effects can reduce the credibility of signals

◆ JET9000V is a digital signal with good integrity, featuring clean and fast rising edges

◆ Abandoning the traditional flat cable connection method for the entire machine, allowing complex circuit systems to have clean signals

◆ Significantly reduce the time required to troubleshoot interference sources, replace fixtures and boards during testing, and obtain stable and reliable data.
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03 Feature Description

In the complete testing process, each step is to protect the product and avoid product damage caused by testing. In addition, modular functional testing makes complex testing easy to handle.
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04 Specifications

Boundary Scan

◆ Boundary scan is proposed by the Electronic Industry Engineering Association and complies with the testing specifications of IEEE1149.1

◆ For densely packed integrated circuit boards, there is no space to place test points

◆ Through four testing points, the chip itself can initiate self testing,

◆ When chips are connected in series, higher measurability can be achieved through boundary scanning
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